Proses Smt o dechnoleg mownt arwyneb

Cynulliad un ochr
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection =>Hailglorhasom
Cynulliad ag ochrau dwbl
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection =>Ailweithio) .
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection =>Ailweithio)
Mae'r broses hon yn addas ar gyfer sodro ail -lenwi ar PCB A ochr a sodro tonnau ar ochr B . Mae'r broses hon yn addas ar gyfer SMDs a ymgynnull ar ochr B y PCB pan nad oes ond SOT neu SOIC (28) pinnau neu lai {.
Proses ymgynnull cymysg un ochr
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection =>Hailglorhasom
Proses ymgynnull cymysg ag ochrau dwbl
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection =>Hailglorhasom
Gwnewch gais yn gyntaf ac yna mewnosodwch, sy'n addas ar gyfer y sefyllfa lle mae mwy o gydrannau SMD na chydrannau arwahanol .
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Hailglorhasom
Mewnosodwch yn gyntaf ac yna cymhwyswch, sy'n addas ar gyfer y sefyllfa lle mae mwy o gydrannau arwahanol na chydrannau SMD .
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Ail -weithio Cynulliad Cymysg Ochr, B Ochr SMD .
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection =>Ail -weithio Mowntio Ochr, B ochr B Mounting Mounting .
Proses ymgynnull dwy ochr
A: Archwiliad deunydd sy'n dod i mewn, past sodr sgrin sidan (glud patsh ceg y groth) ar ochr y PCB, ceg y groth, sychu (halltu), sodro ail -lenwi ochr, glanhau, fflipio bwrdd; past sodr sgrin sidan (glud patsh ceg y groth) ar ochr B y PCB, ceg y groth, sychu, ail -lenwi sodro (yn ddelfrydol yn unig ar gyfer ochr B, glanhau, archwilio, ail -weithio)
Mae'r broses hon yn addas ar gyfer mowntio SMDs mawr fel PLCC ar ddwy ochr y PCB .
B: Archwiliad deunydd sy'n dod i mewn, past sodr argraffu sgrin ar ochr A o PCB (rhoi glud SMD), SMD, sychu (halltu), ail -lenwi sodro ar ochr A, glanhau, a fflipio; Cymhwyso glud SMD ar ochr B o PCB, SMD, halltu, sodro tonnau ar ochr B, glanhau, archwilio ac ailweithio) mae'r broses hon yn addas ar gyfer ail -lenwi ar ochr A o PCB .